Job Title : PVD Engineer 

Primary Location: Berkeley, CA

 

Job Description: 

Define Physical Vapor Deposition (PVD) experiments including RF/DC power(s), power ratios between different targets, total pressure, reactive gas pressure, gas flows, temperature, heating and cooling rates. Write and automate deposition recipes on PVD tools to perform experiments and execute deposition of PVD films on variety of substrates. Measure the deposited films with various tools and techniques on the thickness, electrical resistance, and crystal structure.   Define the metrologies required and manage the logistics. Familiar with metrology data including Transmission Electron Microscopy data, advanced X-ray Diffraction data, X-ray Photoelectron Spectroscopy data, Rutherford Backscattering data, Piezo-force Microscopy data, Advanced Ferroelectric testing data, and Capacitor testing data. Develop metrology recipes and models, composition measurement techniques. Identify critical PVD tool hardware requirements. Participate in device fabrication process, and present scientific reports/data to working group(s) and management. 

 

Requirement: 

• Bachelor of Science in Materials Science, Nuclear Engineering or related. 

• Skills and Knowledge: 

• ​Device fabrication/integration

• Industry-standard PVD tool hardware and process-hardware correlations.

• Thin film materials science, physical and chemical properties of thin films and their co-relations with electrical properties.

• Thin film physical and chemical characterization techniques, such as x-ray diffraction, ellipsometry, sheet resistance, and AFM, etc.

 

Candidates can apply by submitting a resume and cover letter to ta@keplercompute.com

 

*The US, California salary will be $103,896 per year.